Rapidus’ semiconductor manufacturing technology (3): Rapid & Unified Manufacturing Service (RUMS) Rapid & Unified Manufacturing Service (RUMS), proposed by Rapidus, tends to include OSAT (Outsourced Semiconductor Assembly and Test) due to the sound of the word unified. However, Rapidus does not appear to have made such a statement. RUMS meets …
Rapidus transistor manufacturing technology (1): About Planar type, FinFET type and Gate-All-Around type IBM announced on May 6, 2021, the world’s first his 2-nanometer (nm) chip technology, a major advance in semiconductor design and processing. The technology is based on IBM’s second-generation nanosheet technology and incorporates a Gate-All-Around (GAA) nanosheet …
Manufacturing technology in Rapidus (2) DMCO = Design‐Manufacturing Co-Optimization Japan’s Rapidus’ announcement that it will adopt DMCO (Design for Manufacturing and Co-Optimization) in its 2nm manufacturing process demonstrates Rapidus’ corporate stance to break head-on into the core of FinFET and 3D semiconductor technology. It tells a story. 1. Design for …
Disclaimer: The insights and analyses presented in this article are those of RISC-V Alliance Japan and do not represent the official stance or commentary of DENSO. Other RISC-V Day Tokyo 2024 Winter Articles: DENSO joins RISC-V International: http://riscv.or.jp/2024/01/denso-risc-v/ Codasip: https://riscv.or.jp/en/2023/11/codasip-talks-about-how-custom-compute-will-change-the-world/ SMR: https://riscv.or.jp/en/2023/12/going-nuclear-a-guide-to-smrs-and-nuclear-powered-data-centers/ Rapidus 2nm Fab: https://riscv.or.jp/en/2023/12/22596/ IBM and Rapidus: …
If you are interested in registering for RISC-V Day Tokyo 2024 on January 16, 2024, click here. Codasip has made significant advances in RISC-V processor technology. Recently they announced a new series of RISC-V processors called the 700 family. The series is a highly configurable family of processors designed for …
