Manufacturing technology at Rapidus (2) DMCO = Design‐Manufacturing Co-Optimization

Manufacturing technology in Rapidus (2) DMCO = Design‐Manufacturing Co-Optimization

Japan’s Rapidus’ announcement that it will adopt DMCO (Design for Manufacturing and Co-Optimization) in its 2nm manufacturing process demonstrates Rapidus’ corporate stance to break head-on into the core of FinFET and 3D semiconductor technology. It tells a story.

1. Design for Manufacturing (DFM): DFM is a collection of techniques for designing products to be simpler and more cost-effective to manufacture. In the context of semiconductor manufacturing, DFM means designing integrated circuits considering the capabilities and limitations of the manufacturing process. This approach helps reduce defects, improve yield, and improve chip reliability. As FinFET and 3D semiconductors have highly advanced architectures, DFM allows designs to be better suited to manufacturing capabilities, reducing manufacturing issues and producing higher quality products.

2. Co-Optimization: Co-optimization in semiconductor manufacturing refers to the process of optimizing the design and manufacturing process simultaneously to achieve optimal performance, yield, and cost. This approach is especially important for advanced technologies like FinFET and 3D semiconductors, where the interaction between design and manufacturing processes is complex and closely related. Collaborative optimization ensures that designs make the most of manufacturing capacity, producing efficient and powerful chips.

3. Impact on FinFET: FinFET (Fin field effect transistor) is a type of 3D transistor used in modern semiconductor devices. The use of DMCO in FinFET technology can lead to efficient designs that minimize power consumption and heat generation while maximizing FinFET performance advantages. It can also help scale down FinFET structures to smaller nodes (e.g. 2nm) to meet performance-power ratio demands in next-generation electronic devices.

4. What 3D semiconductors mean for Rapidus: 3D semiconductors that stack multiple component layers benefit greatly from DMCOs to address the unique challenges of 3D integration, such as thermal management, interconnect optimization, and layer alignment. receive. Using DMCO, Rapidus is able to design 3D structures that are both high performance and manufacturable with high yield. This is an important factor in the cost and feasibility of advanced semiconductor technology.

Rapidus’ adoption of DMCO in its 2nm Fab is a robust strategy to address the increasing complexity of new generation semiconductor technologies such as FinFET and 3D semiconductors. This approach is likely to lead to more efficient, high-performance, and reliable semiconductor components that will be essential for the next generation of electronic devices.

Manufacturing-friendly design and co-optimization (DMCO) in semiconductor manufacturing uses a synergistic process where both the semiconductor design and manufacturing process are jointly optimized. A step-by-step explanation of how DMCO generally progresses.

5. Initial design phase: Design engineers perform initial design work for semiconductor devices, such as the layout of transistor components, interconnect wiring, and other components. This design effort is intended to achieve the desired performance characteristics of the system, such as operating speed, power consumption, and area.

6. Manufacturing process inspection: Parallel to the design phase described above, the capabilities and limitations of the manufacturing process are evaluated. This includes simulating lithography, etching, material deposition, and other manufacturing steps.

7. Close collaboration between semiconductor design and manufacturing stages: Initial designs are evaluated against the capabilities of the manufacturing process. This step leverages simulation and predictive models to predict how the design will perform during manufacturing.

8. Iterative optimization: Both design and manufacturing processes are iteratively adjusted to align with each other. For example, if certain features of the design prove difficult to manufacture with high yield, the design may be changed. Similarly, if a manufacturing step proves to be a bottleneck, the process will be adjusted.

9. Finalization and prototyping: Once the optimal balance is achieved, the design is finalized. Prototypes are manufactured to test the design in real-world conditions. This phase includes thorough performance, yield, and reliability testing.

10. Mass production: After successful prototyping and testing, the design is ready for mass production. A co-optimized design and manufacturing process ensures high yield, quality, and performance consistency.

To visualize this concept, we will create a graphic representing the DMCO process in semiconductor manufacturing. This graphic visually represents each stage of DMCO, including initial design, manufacturing process evaluation, design and process integration, iterative optimization, finalization and prototyping, and mass production, with associated icons and symbols.

It will help you understand the DMCO process in a more visual and educational context.