Title: Rapidus ramps as construction begins on 2nm wafer fab
Author: Tobias Mann
Published on: September 1, 2023
Source: The Register
Japan’s semiconductor startup Rapidus has started construction of its IIM-1 plant in Hokkaido, aiming to launch a 2nm wafer fabrication facility by 2025. The company has rapidly expanded its workforce, hiring over 200 people in preparation for this ambitious project. Supported by significant government subsidies and in collaboration with IBM for advanced chip technology, Rapidus is set to compete with industry giants like TSMC, Samsung Electronics, and Intel. Despite potential challenges in skilled workforce availability, Rapidus is determined to spearhead the development of advanced semiconductor technology in Japan.