Event Date: Thursday, March 5, 2026
Venue: Ito International Academic Research Center,
The University of Tokyo (Hongo Campus) Click here for Venue Information
RISC-V Day Tokyo is one of Japan’s largest RISC-V–focused technical conferences, held annually since 2017 at the University of Tokyo. Each year, the event brings together 400–500 researchers, engineers, students, and industry professionals. This page provides publicly shareable information for organizations considering sponsorship of the 2026 Spring event.
1. Sponsorship Categories (Summary)
The following sponsorship tiers are available:
Diamond (Top tier)
Platinum
Silver
Bronze
Supporter (Exhibition only)
Detailed pricing and full benefits are provided individually upon request.
Pricing is not published online.
2. Important Dates (for Sponsors & Presenters)
| Item | Schedule |
|---|---|
| Event Date | March 5, 2026 (Thu) |
| Deadline for Banner / Advertisement Data | 10 business days before the event (mid-February) |
| CFP Opens | January 10, 2026 |
| CFP Deadline | February 7, 2026 |
| Presentation Acceptance Notice | February 10, 2026 |
| Exhibit Material Move-in | March 4 (Wed) 13:00–17:00 (Day-before move-in only) |
| Same-day Move-in (exceptional) | March 5, 8:00–8:30 (not recommended due to congestion) |
| Move-out | March 5, 17:00–18:00 (shipping label preparation on-site) |
3. Exhibition Booth Specifications (Common to All Sponsors)
■ Demo Table Provided
Standard demo table will be prepared for each exhibitor.
■ Banner (X-banner stand type)
Requires Adobe Illustrator (.ai) data submission
Banner dimensions follow event guidelines (details provided upon request)
■ A1 Storyboard Display Method (Unique to This Event)
Each exhibitor may display an A1-size storyboard (7mm thick board).
How it works:
Exhibitor brings an A1 poster printed on paper.
The poster is attached to the storyboard using push pins.
The storyboard itself is secured to the desk or wall using low-adhesive masking tape.
May be used as a technical poster.
Lightweight items (PCBs, photos, cards, etc.) may be attached.
Strong adhesive tape is prohibited by venue rules.
4. Logistics: Move-in & Move-out (Important)
■ Move-in Policy
Primary Move-in: March 4 (Wed), 13:00–17:00
Day-of Move-in: Allowed only from 8:00–8:30 via the back elevator (not recommended)
■ Shipping & Transport
Please arrange courier delivery to arrive on the afternoon of March 4.
On-site storage before this time is not available.
■ Example Items
Demo hardware (FPGA boards, PCs, devices)
Pamphlets, brochures, business cards, novelties
A1 storyboard & poster
■ Move-out
Prepare shipping labels in advance for smooth courier pickup.
Move-out time is 17:00–18:00 on March 5.
5. Technical Presentations
CFP (Call for Presentations)
We welcome proposals in the following areas:
RISC-V architecture and implementations
HPC / AI computing
Chiplet / Packaging / Interconnect
EDA tools, IP, design methodologies
Open hardware, PDK/EDA ecosystems
Semiconductor education
FPGA-based development
Related system and software technologies
Presentations are reviewed by the program committee.
Sponsor companies may apply for designated talk slots depending on their sponsorship tier.
6. Contact (Request for Sponsor Prospectus PDF)
To request the full Sponsor Prospectus, including pricing and detailed benefits, please contact the Secretariat:
RISC-V Day Tokyo Secretariat (Shumpei Kawasaki)
📧 shumpei.kawasaki@swhwc.com
📞 +81-70-2803-8231
